935260061118 データシートの表示（PDF） - Philips Electronics
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935260061118 Datasheet PDF : 24 Pages
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
2 Specifications
2.1 Mechanical Properties
Width
7.55 mm
(Proposed Punching Outline)
Length
11.75 mm
(Proposed Punching Outline)
Overall Thickness
0.45 mm ± 0.03 mm
Film Thickness
0.16 mm ± 0.005 mm
Bondpad Size for
Transponder Coil / Module
Interconnection
1.9 x 3.5 mm
see also drawing in chapter 3
Suitable for Welding/Soldering/
Conductive Gluing
2.2 Materials
Tape
Copper Plating
Bond Plating
Backside Plating
Glob Top
110 µm
35 µm
Ni / Au
Ni / Au
Filled Epoxy
Glass epoxy
ED copper
Suitable for Al and Au wire
bonding
Thermal curing
2.3 Temperature Range
Operating
Processing
-25°C to +85°C
150°C for 30 minutes
Welding Parameters
Soldering Parameters
max. 25 ms @ 500 °C
max. 3 s @ 390 °C
For packed transponder,
depending on type of package
at a standard lamination
pressure for contactless smart
card plastic materials (e.g. PVC,
PET, ...)
on bond pads
on bond pads
Ht1moa3.doc/HS
Page 4 of 24
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