935260218122 データシートの表示（PDF） - Philips Electronics

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935260218122

HITAG™ 1 Chip Module

Philips Electronics 

Specifications of the HT1 MOA3 S30

Rev. 1.1

2.4 Storage Conditions

Temperature

Relative Humidity

Duration

15 - 30 °C

40 - 70 %

1 year

1997-08-19

2.5 Delivery Conditions

Delivery Identification

Types of Delivery

Date of ready for shipment, reel numbers, total quantity of good

modules with the detail of good modules per reel, order number,

product type, no supplier identification on reels, bags and boxes.

Chip modules on reel

approx. 15.000 to 20.000

pcs. per reel,

tape width super 35 mm,

pitch 9,5 mm, 2 rows

single chip modules (bulk goods)

500 pcs . per bag

Packing and Transport According to documentation

"Packing Method Modules (reel)"

Order-No. 3322 845 04881

"Packing Method Modules (singulated)"

Bad Module Marking

All bad modules (mechanical and

electrical faults) must be punched by

reject hole for customer

see drawings chapter 3

Bad positions (reel): <20%

Splicing Specifications

Tape material: adhes. tape 15,5 +/- 0,7

mm, thermal resistance at

<190°C by < 100 cN tractive power and

< 30 sec. duration.

see drawings chapter 3

Labeling

Identification label on the reel and on

carton bag:

- Product type

- Number of the reel

- Total number of positions

- Number of good positions

- Date of sealing (to be checked)

- Two batches per reel only

- Batchnumber indication (only coded,

to be checked)

Ht1moa3.doc/HS

Page 5 of 24

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