CHFP6KE10 データシートの表示（PDF） - Microsemi Corporation

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CHFP6KE10

FLIP-CHIP TVS DIODES

Microsemi Corporation 

8700 E. Thomas Road

Scottsdale, AZ 85251

Tel: (480) 941-6300

Fax: (480) 947-1503

FLIP-CHIP TVS DIODES

CHFP6KE5.0

thru

CHFP6KE170CA

FEATURES

• Unidirectional and Bidirectional

• Fully glass passivated

• 600 watt (10/1000 µs)

• Eliminates wire bonding

• NON Inductive Insertion

• No voltage overshoot

MECHANICAL

• Weight: 0.01 grams (approximate)

• Solderable standoff tabs .040X.040X.010

PACKAGING

• Waffle package 50 pices or wafer ring 70 pieces

Patented Flip-Chip Series

MAXIMUM RATINGS

• Max Junction Temperature: 1500C (with conformal coating)

• Storage Temperature: -550C to +1500C

• Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µs)

• Maximum non-repetitive peak power 600 Watts (10/1000 µs)

• Total continuous power dissipation 2.5 W (with adequate heat

sink @ 750C)

• Turn-on time (theoretical) unidirectional 1X10-12

• Turn-on time (theoretical) bidirectional 1X10-9

BIDIRECTIONAL ALL DIMENSIONS NOMINAL

inches (mm)

FLIP-CHIP DIMENSIONS

PAD SIZE & CIRCUIT

UNIDIRECTIONAL ALL DIMENSIONS NOMINAL

inches (mm)

FLIP-CHIP DIMENSIONS

PAD SIZE & CIRCUIT

MSC1596.PDF

VBR above 30 V

VBR 30V and below

ISO 9001 CERTIFIED

REV B 3/13/2000

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