CM1400-03CP データシートの表示（PDF） - ON Semiconductor

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CM1400-03CP

6 Channel EMI Filter Array with ESD Protection

ON Semiconductor 

CM1400-03

Application Information

PARAMETER

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Flux Ratio

Solder Paste Type

Pad Protective Finish

Tolerance — Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous

Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder

Paste

VALUE

0.240mm

Round

Non-Solder Mask defined pads

0.290mm Round

0.125mm - 0.150mm

0.300mm Round

50/50 by volume

No Clean

OSP (Entek Cu Plus 106A)

+50μm

+20μm

60 seconds

260°C

Non-Solder Mask Defined Pad

0.240mm DIA.

Solder Stencil Opening

0.300mm DIA.

Solder Mask Opening

0.290mm DIA.

Figure 8. Recommended Non-Solder Mask Defined Pad Illustration

Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile

Rev. 3 | Page 11 of 14 | www.onsemi.com

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