CM1402 データシートの表示（PDF） - ON Semiconductor

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CM1402

SIM Card EMI Filter Array with ESD Protection

ON Semiconductor 

CM1402

CSP Mechanical Specifications

CM1402 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented

below. For complete information on CSP packaging, see the California Micro Devices CSP Package

Information document.

Controlling dimension: millimeters

PACKAGE DIMENSIONS

Package

Bumps

Custom CSP

10

Millimeters

Dim

Inches

Min Nom Max Min Nom Max

A1 1.915 1.960 2.005 0.0754 0.0772 0.0789

A2 1.285 1.330 1.375 0.0506 0.0524 0.0541

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.180 0.230 0.280 0.0071 0.0091 0.0110

C2 0.180 0.230 0.280 0.0071 0.091 0.0110

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

BOTTOM VIEW

A1

C1

B2

B1

C

B

A

1234

0.30 DIA.

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

SOLDER BUMPS

D1

D2

SIDE

VIEW

DIMENSIONS IN MILLIMETERS

Package Dimensions for CM1402

Chip Scale Package

Rev. 3 | Page 11 of 12 | www.onsemi.com

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