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CM1440-06CP データシートの表示(PDF) - ON Semiconductor

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CM1440-06CP Datasheet PDF : 12 Pages
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CM1440
Mechanical Details
CSP Mechanical Specifications
CM1440 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the California Micro Devices CSP Package Information
document.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
15
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 2.3150 2.3600 2.4050 0.911 0.0929 0.0947
A2 1.008 1.053 1.098 0.0397 0.0415 0.0432
B1 0.395 0.4000 0.405 0.0156 0.0157 0.0159
B2 0.195 0.2000 0.205 0.0076 0.0078 0.0080
B3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
B4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
C1 0.130 0.1800 0.230 0.0051 0.0071 0.0091
C2 0.130 0.1800 0.230 0.0051 0.0071 0.0091
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
0.25 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Package Dimensions for
CM1440 Chip Scale Package
Rev. 3 | Page 10 of 12 | www.onsemi.com

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