CM1442-06LP データシートの表示（PDF） - ON Semiconductor

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CM1442-06LP

LCD and Camera EMI Filter Array with ESD Protection

ON Semiconductor 

LCD and Camera EMI Filter Array

with ESD Protection

CM1442-06LP

Features

• Six channels of EMI filtering with integrated ESD

protection

• 0.4mm pitch, 15-bump, 2.360mm x 1.053mm

footprint Chip Scale Package (CSP)

• Pi-style EMI filters in a capacitor-resistor-capacitor

(C-R-C) network

• ±15kV ESD protection on each channel

(IEC 61000-4-2 Level 4, contact discharge)

• ±30kV ESD protection on each channel (HBM)

• Greater than 30dB attenuation (typical) at 1 GHz

• RoHS-compliant, lead-free packaging

Applications

• LCD and camera data lines in mobile handsets

• I/O port protection for mobile handsets, notebook

computers, PDAs etc.

• EMI filtering for data ports in cell phones, PDAs or

notebook computers.

• Wireless handsets

• Handheld PCs/PDAs

• LCD and camera modules

Functional Description

The CM1442-06LP is part of a family of pi-style EMI filter

arrays with ESD protection, which integrates six filters (C-

R-C) in a Chip Scale Package (CSP) form factor with

0.40mm pitch. The CM1442-06LP (low profile) has

component values of 15pF-100Ω-15pF per channel. The

CM1442-06LP has a cut-off frequency of 120MHz and can

be used in applications where the data rates are as high as

48Mbps. The parts include avalanche-type ESD diodes on

every pin, which provide a very high level of protection for

sensitive electronic components against potential

electrostatic discharge (ESD). The ESD protection diodes

safely dissipate ESD strikes of ±15kV, well beyond the

maximum requirement of the IEC61000-4-2 international

standard. Using the MIL-STD-883 (Method 3015)

specification for Human Body Model (HBM) ESD, the pins

are protected for contact discharges at greater than ±30kV.

The CM1442-06LP is available in a space-saving, low-

profile CSP with RoHS-compliant, lead-free finishing. It is

manufactured with a 0.40mm pitch and 0.15mm CSP

solder ball to provide up to 28% board space saving versus

competing CSP devices with 0.50mm pitch and 0.30mm

CSP solder ball.

Package/Pinout Diagrams

©2010 SCILLC. All rights reserved.

March 2010 Rev. 3

Publication Order Number:

CM1442-06LP/D

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