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CM1454 データシートの表示(PDF) - ON Semiconductor

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CM1454 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
CM1454
Mechanical Specifications
CM1454 devices are packaged in custom Chip Scale Packages (CSP). See Application Note AP-217 for more
information at: http://www.wlcspforum.org/documents/pdf/ap-217.pdf.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
20
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 3.915 3.960 4.005 0.1541 0.1559 0.1577
A2 1.541 1.586 1.631 0.0607 0.0624 0.0642
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.308 0.358 0.408 0.0121 0.0141 0.0161
D1 0.574 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Package Dimensions for
CM1454-08CP Chip Scale Package
Rev. 2 | Page 9 of 10 | www.onsemi.com

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