CNY17-1-M.3SD データシートの表示（PDF） - Fairchild Semiconductor
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CNY17-1-M.3SD Datasheet PDF : 11 Pages
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PHOTOTRANSISTOR OPTOCOUPLERS
Black Package (No -M Suffix)
CNY17-1 CNY17-3
CNY17-2 CNY17-4
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.300 (7.62)
TYP
0.350 (8.89)
0.330 (8.38)
3
2
1
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
0.022 (0.56)
0.016 (0.41)
0.020 (0.51)
MIN
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.300 (7.62)
TYP
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.016 (0.41)
0.008 (0.20)
Package Dimensions (0.4”Lead Spacing)
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.004 (0.10)
MIN
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
Recommended Pad Layout for
Surface Mount Leadform
(Black Package Only)
0.070 (1.78)
0.060 (1.52)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
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6/06/01 DS300208
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