CNY173VM(2006) データシートの表示（PDF） - Fairchild Semiconductor

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CNY173VM
(Rev.:2006)

Phototransistor Optocouplers

Fairchild Semiconductor 

White Package (-M Suffix)

Package Dimensions (Through Hole)

0.350 (8.89)

0.320 (8.13)

Pin 1 ID

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.014 (0.36)

0.010 (0.25)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 (2.54)

0.320 (8.13)

15°

0.012 (0.30)

Package Dimensions (0.4” Lead Spacing)

0.350 (8.89)

0.320 (8.13)

PIN 1 ID

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.014 (0.36)

0.010 (0.25)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

Note:

All dimensions are in inches (millimeters)

Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

Pin 1 ID

0.390 (9.90)

0.260 (6.60) 0.332 (8.43)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.012 (0.30)

0.008 (0.20)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.035 (0.88)

0.012 (0.30)

Recommended Pad Layout for Surface Mount

Leadform (White Package Only)

0.070 (1.78)

0.060 (1.52)

0.425 (10.79)

0.100 (2.54)

0.305 (7.75)

0.030 (0.76)

11

CNY17X, CNY17FX, MOC810X Rev. 1.0.6

www.fairchildsemi.com

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