CR2010J データシートの表示（PDF） - Bourns, Inc

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CR2010J

Bourns® Chip Resistors & Arrays

Bourns, Inc 

Chip Array vs DIP Package

Chip Array

• Ceramic has protective coating on top

• Terminate to metallization on ceramic

• Low power

DIP Package

• Ceramic covered with molding

• Terminate to pins connected to ceramic

• Higher power rating than chip array

Chip Resistor and Chip Array Applications

• Test equipment

• Consumer electronics

• Appliances

• Telecommunications

• Hand-held electronics

• Office equipment

• Industrial equipment

• Small signal instrumentation

• DC/DC converters in power modules

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