CRF03 データシートの表示（PDF） - Toshiba
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CRF03 Datasheet PDF : 4 Pages
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TOSHIBA Fast Recovery Diode Silicon Diffused Type
CRF03
CRF03
Switching Mode Power Supply Applications
Unit: mm
• Repetitive peak reverse voltage : VRRM = 600 V
• Average forward current
: IF (AV) = 0.7 A
• Peak forward voltage
: VFM = 2.0 V (max.)
• Very fast reverse-recovery time : trr = 100 ns (max.)
• Small, thin package suitable for high-density board assembly
Toshiba Nickname: “S-FLATTM”
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
VRRM
600
V
Average forward current
IF(AV)
0.7 (Note 1)
A
Non-repetitive peak forward surge current
IFSM
10 (50 Hz)
A
JEDEC
―
Junction temperature
Tj
−40 to 150
°C
Storage temperature range
Tstg
−40 to 150
°C
JEITA
―
Note 1: Ta = 76°C Device mounted on a ceramic board
TOSHIBA
3-2A1S
Board size : 50 mm × 50 mm,
Soldering land size : 2 mm × 2 mm
Weight: 0.013 g (typ.)
Board thickness : 0.64 mm
Rectangular waveform (α = 180°)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Thermal resistance
(junction to ambient)
Thermal resistance (junction to lead)
Symbol
Test Condition
Min Typ. Max Unit
VFM
IRRM
trr
Rth (j-a)
Rth (j-ℓ)
IFM = 0.7 A (Pulse test)
VRRM = 600 V (Pulse test)
IF = 1 A, di/dt = −30 A/µs
Device mounted on a ceramic board
board size
: 50 mm × 50 mm
soldering land size : 2 mm × 2 mm
board thickness : 0.64 mm
1.5 2.0
V
50
µA
100 ns
70
Device mounted on a glass-epoxy board
board size
: 50 mm × 50 mm
soldering land size : 6 mm × 6 mm
board thickness : 1.6 mm
140 °C/W
Device mounted on a glass-epoxy board
board size
: 50 mm × 50 mm
soldering land size : 1.2 mm × 1.2 mm
board thickness : 1.6 mm
240
20 °C/W
Start of commercial production
2003-12
1
2018-07-13
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