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CRF03 データシートの表示(PDF) - Toshiba

部品番号
コンポーネント説明
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CRF03 Datasheet PDF : 4 Pages
1 2 3 4
IF – VF
10
Tj = 150°C
1
75°C
25°C
0.1
0.01
0
Pulse test
1
2
3
4
5
Forward voltage VF (V)
Ta max – IF (AV)
160
Device mounted on a glass-epoxy board:
board size : 50 mm × 50 mm
140
Soldering land size : 6 mm × 6 mm
board thickness : 1.6 mm
120
100
80
α = 60°
60
Rectangular
waveform
40
0° α 360°
20 Conduction
angle: α
120°
180°
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Average forward current IF (AV) (A)
CRF03
PF (AV) – IF (AV)
1.2
1.0
180°
120°
0.8
α = 60°
0.6
Rectangular
0.4
waveform
0.2
0° α 360°
Conduction
angle: α
0
0
0.2
0.4
0.6
0.8
1.0
Average forward current IF (AV) (A)
Ta max – IF (AV)
160
Device mounted on a ceramic board:
board size : 50 mm × 50 mm
140
Soldering land size : 2 mm × 2 mm
board thickness : 0.64 mm
120
100
α = 60°
80
60
Rectangular
waveform
40
0° α 360°
20 Conduction
angle: α
120°
180°
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Average forward current IF (AV) (A)
Repetitive peak forward current
12
Ta = 25°C
f = 50 Hz
10
8
6
4
2
0
1
10
100
Number of cycles
rth (j-a) – t
1000
Device mounted on a glass-epoxy board
board size : 50 mm × 50 mm,
Soldering land size : 1.2 mm × 1.2 mm
board thickness : 1.6 mm
100
Device mounted on a glass-epoxy board
board size : 50 mm × 50 mm,
10
Soldering land size : 6 mm × 6 mm
board thickness : 1.6 mm
Device mounted on a ceramic board
board size: 50 mm × 50 mm
Soldering land size: 2 mm × 2 mm
board thickness: 0.64 mm
1
0.001
0.01
0.1
1
10
100
1000
Time t (s)
3
2018-07-13

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