CRG05 データシートの表示（PDF） - Toshiba
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CRG05 Datasheet PDF : 4 Pages
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CRG05
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Thermal resistance
Marking
Symbol
VFM(1)
VFM(2)
VFM(3)
IRRM
Rth (j-a)
Rth (j-ℓ)
Test Condition
IFM = 0.1 A (Pulse test)
IFM = 0.7 A (Pulse test)
IFM = 1.0 A (Pulse test)
VRRM = 800 V (Pulse test)
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64 mm
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6 mm
―
Min Typ. Max Unit
⎯ 0.86 ⎯
V
⎯
1.0
⎯
V
⎯ 1.05 1.2
V
⎯
⎯
10
μA
⎯
⎯
65
°C/W
⎯
⎯
130
⎯
⎯
20 °C/W
Abbreviation Code
G5
Part No.
CRG05
Standard Soldering Pad
1.2
1.2
2.8
Unit: mm
Handling Precaution
The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant. The
followings are the general derating methods that we recommend when you design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum
rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device
at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the maximum rating of IF(AV). Carry out
adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an
allowable Ta max-IF(AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2
2008-02-01
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