CS1630-FSZR データシートの表示（PDF） - Apex Microtechnology
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CS1630-FSZR Datasheet PDF : 56 Pages
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CS1630/31
3.4 Thermal Resistance
Symbol
Parameter
JA Junction-to-ambient Thermal Impedance
JC Junction-to-case Thermal Impedance
2 Layer PCB
4 Layer PCB
2 Layer PCB
4 Layer PCB
Value
84
47
39
31
Unit
°C / W
°C / W
°C / W
°C / W
3.5 Absolute Maximum Ratings
Characteristics conditions:
All voltages are measured with respect to GND.
Pin
Symbol
Parameter
Value
Unit
14
1, 2, 5, 6, 7, 9,
10, 11, 15, 16
VDD IC Supply Voltage
Analog Input Maximum Voltage
18.5
V
-0.5 to (VDD+0.5)
V
1, 2, 6, 7, 9, 10,
11,15,16
Analog Input Maximum Current
5
mA
13
13
5
3
-
-
-
All Pins
VGD Gate Drive Output Voltage
-0.3 to (VDD+0.3)
V
IGD
Gate Drive Output Current
-1.0 / +0.5
A
ISOURCE Current into Pin
1.1
A
ICLAMP Clamp Output Current
5
mA
PD
Total Power Dissipation
400
mW
TJ
Junction Temperature Operating Range
(Note 8) -40 to +125
ºC
TStg Storage Temperature Range
-65 to +150
ºC
ESD Electrostatic Discharge Capability
Human Body Model
Charged Device Model
2000
500
V
V
Note:
8. Long-term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation at
the rate of 50mW/ºC for variation over temperature.
WARNING:
Operation at or beyond these limits may result in permanent damage to the device.
Normal operation is not guaranteed at these extremes.
10
DS954F2
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