DG201 データシートの表示（PDF） - Harris Semiconductor
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DG201 Datasheet PDF : 8 Pages
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Metallization Topology
DIE DIMENSIONS:
94 x 101 x 14 ± 1mils
METALLIZATION:
Type: Al
Thickness: 10kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2/Si3N4
SiO2 Thickness: 7kÅ ± 1.4kÅ
Si3N4 Thickness: 8kÅ ± 1.2kÅ
WORST CASE CURRENT DENSITY:
1 x 105 A/cm2
Metallization Mask Layout
D1
(2)
S1 (3)
DG201
DG201
IN1
IN2
(1)
(16)
D2
(15)
(14) S2
V- (4)
GND (5)
(13) V+ (SUBSTRATE)*
S4 (6)
(7)
D4
(8)
(9)
IN4
IN3
(11) S3
(10)
D3
* Backside of Chip is V+
9-20
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