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DIM200PHM33-F000(2004) データシートの表示(PDF) - Dynex Semiconductor
部品番号
コンポーネント説明
メーカー
DIM200PHM33-F000
(Rev.:2004)
Half Bridge IGBT Module
Dynex Semiconductor
DIM200PHM33-F000 Datasheet PDF : 9 Pages
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2
3
4
5
6
7
8
9
DIM200PHM33-F000
PACKAGE DETAILS
For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
1(E1/C2)
2(C1)
5(E
1)
4(G
1)
8(C
1)
3(E2)
7(E
2)
6(G
2)
Nominal weight: 750g
Module outline type code: P
Fig. 11 Package details
8/9
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
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