DS1647 データシートの表示（PDF） - Dallas Semiconductor -> Maxim Integrated
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コンポーネント説明
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DS1647 Datasheet PDF : 11 Pages
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DS1647 32-PIN PACKAGE
DS1647P
DS1647/DS1647P
PKG
DIM
A IN.
MM
B IN.
MM
C IN.
MM
D IN.
MM
E IN.
MM
F IN.
MM
G IN.
MM
H IN.
MM
J IN.
MM
K IN.
MM
32-PIN
MIN MAX
1.680 1.740
42.67 44.20
0.715 0.740
18.16 18.80
0.335 0.365
8.51 9.27
0.075 0.105
1.91 2.67
0.015 0.030
0.38 0.76
0.140 0.180
3.56 4.57
0.090 0.110
2.29 2.79
0.590 0.630
14.99 16.00
0.010 0.018
0.25 0.46
0.015 0.025
0.38 0.64
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.980
-
0.052
0.048
0.015
0.025
INCHES
NOM
0.925
0.985
-
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE:
For the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live - bug”).
b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
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