DSP56371 データシートの表示（PDF） - Motorola => Freescale

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DSP56371

DSP56371 is a high density CMOS device

Motorola => Freescale 

Freescale Semiconductor, Inc.

Thermal Characteristics

To prevent a high current condition upon power up, the IOVDD must be applied ahead of the CORE VDD

as shown below if the external Schottcky is not used.

CORE VDD

IO VDD

4.0 Thermal Characteristics

Table 2 Thermal Characteristics

Characteristic

Symbol TQFP Value

Unit

Natural Convection, Junction-to-ambient thermal

resistance1,2

Junction-to-case thermal resistance3

RθJA or θJA

RθJC or θJC

39

18.25

°C/W

°C/W

Note:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal

resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation

of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1).

MOTOROLA

DSP56371 Technical Data

3

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