ML6554CU データシートの表示（PDF） - Micro Linear Corporation

部品番号

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ML6554CU

3A Bus Termination Regulator

Micro Linear Corporation 

ML6554

60

60

40

40

20

20

16Ld PSOP2

2.3x3.1mm PAD

1.9mm DIE

0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

POWER (W)

NATURAL CONVECTION ΘJA TEST RESULTS

1.27mm PITCH PowerSOP™ 2

SLUG SOLDERED

16Ld PSOP2

2.3x3.1mm PAD

1.9mm DIE @ 0.8 WATTS

0

0

100

200

300

400

500

AIR VELOCITY (LFPM)

FORCED CONVECTION ΘJA TEST RESULTS

1.27mm PITCH PowerSOP™ 2

SLUG SOLDERED

Figure 10. Graphical Results Summary – 1S2P Test Board

DRAWING NUMBER

Applicable Jedec Spec

Substrate Material

Dimensions (LxW) (Overall)

Dimensions (LxW) (Metallization)

Dimensions (LxW) (Inner Planes)

Thickness

Pitch

Stackup (# Signal Layers, # Cu Planes)

Cu Trace Coverage (Signal Layer)

Cu Coverage (Internal Layer)

Trace Width (Spec/Measured)

Trace Cu Thickness (Spec/Measured)

Inner Cu Thickness (Spec/Measured)

Build #

ENG-CB-1007 REV A

JC 51-X (Note 1)

(Sroposed Spec)

FR-4

114.3 x 76.2mm

55 x 65mm

73 x 73mm

1.6 mm

1.27mm

1S2P

12%

100%

235.5±25.5/288µm

70±14/67µm

35±3.5/31µm

C1797

Note 1: Proposed Spec "Thermal Test Board with Two Internal Solid Copper Planes for leaded Surface Mount Packages".

Figure 11. Test Board Layout for QJA vs. Airflow

NOVEMBER, 1999

11

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