EMIF02-MIC03C2 データシートの表示（PDF） - STMicroelectronics

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EMIF02-MIC03C2

2 line EMI filter and ESD protection

STMicroelectronics 

EMIF02-MIC03C2

2 line EMI filter and ESD protection

Main product characteristics

Where EMI filtering in ESD sensitive equipment is

required:

■ Mobile phones and communication systems

■ Computers and printers and MCU Boards

Description

The EMIF02-MIC03C2 is a highly integrated

device designed to suppress EMI/RFI noise in all

systems subjected to electromagnetic

interference. The Flip-Chip packaging means the

package size is equal to the die size.

This filter includes ESD protection circuitry, which

prevents damage to the application when it is

subjected to ESD surges up to 15 kV.

Benefits

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency EMI filter (-35 dB @ 900 MHz)

■ Very low PCB space consumption:

1.07 mm x 1.47 mm

■ Very thin package: 0.695 mm

■ Coating resin on back side and lead free

package

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging.

Coated Flip-Chip package

(about 20 times real size)

Pin configuration (Bump side)

321

I2

I1

A

GND

B

O2 O1 C

Complies with following standards:

IEC 61000-4-2

level 4 input pins

level 1 output pins

15 kV

8 kV

2 kV

2 kV

(air discharge)

(contact discharge

(air discharge)

(contact discharge

MIL STD 883G - Method 3015-7 Class 3

November 2006

Rev 1

1/7

www.st.com

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