EMIF02-MIC03F3 データシートの表示（PDF） - STMicroelectronics

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EMIF02-MIC03F3

2 LINES EMI FILTER INCLUDING ESD PROTECTION

STMicroelectronics 

EMIF02-MIC02F2

Figure 11: Ordering Information Scheme

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms)

z = capacitance value / 10(pF)

or

3 letters = application

2 digits = version

Package

F = Flip-Chip

x = 1: 500µm, Bump = 315µm

= 2: Leadfree Pitch = 500µm, Bump = 315µm

= 3: Leadfree Pitch = 400µm, Bump = 250µm

Figure 12: FLIP-CHIP Package Mechanical Data

500µm ± 50

315µm ± 50

650µm ± 65

1.07mm ± 50µm

Figure 13: Foot print recommendations

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

Figure 14: Marking

Dot, ST logo

xx = marking

z = packaging

location

yww = datecode

(y = year

ww = week)

All dimensions in µm

365

240

E

xxz

y ww

5/7

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