EMIF02-USB02F2 データシートの表示（PDF） - STMicroelectronics
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EMIF02-USB02F2 Datasheet PDF : 7 Pages
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EMIF02-USB02F2
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 10. Flip Chip package dimensions
700µm ± 50
315µm ± 50
650µm ± 65
495µm ± 50
495µm ± 50
285 µm
1.62mm ± 50µm
Figure 11. Footprint recommendations
Copper pad Diameter:
250 µm recommended, 300 µm max.
Solder stencil opening:
330 µm recommended
Figure 12. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening recommendation:
340 µm min. for 300 µm copper pad diameter
E
xxz
y ww
5/7
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