EMIF08-LCD04M16
3
Package information
Package information
Note:
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3. Micro QFN 3.3x1.35 16L dimensions
INDEX AREA
(D/2 x E/2)
TOP VIEW
D
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
E
A 0.45 0.50 0.55 0.018 0.020 0.022
A
INDEX AREA
(D/2 x E/2)
1
SIDE VIEW
A1
BOTTOM VIEW
e
b
8
EXPOSED PAD
A1 0.00 0.02 0.05 0.00 0.0008 0.002
b 0.15 0.20 0.25 0.006 0.008 0.010
D
- 3.30 -
- 0.13 -
D2 2.65 2.80 2.90 0.104 0.110 0.114
E
- 1.35 -
- 0.053 -
PIN # 1 ID
16
L
E2
9
D2
K
E2 0.25 0.40 0.50 0.010 0.016 0.020
e
- 0.40 -
- 0.016 -
k 0.20 -
- 0.008 -
-
L 0.15 0.25 0.35 0.006 0.010 0.014
Figure 9. Footprint
0.40
0.20
0.45
0.40
2.80
3.00
0.85 1.75
Figure 10. Marking
Dot: Pin 1
XX XX: Marking
WW WW: Assembly week
YP
Y: Assembly year
P: Assembly plant
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
Doc ID 15673 Rev 2
5/10