ESDA14V2-4BF2(2008) データシートの表示（PDF） - STMicroelectronics
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ESDA14V2-4BF2 Datasheet PDF : 8 Pages
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ESDA14V2-4BF2
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Ordering information scheme
Ordering information scheme
Figure 12. Ordering information scheme
ESDA 14V2 - 4 B Fx
ESD Array
Breakdown Voltage
14V2 = 14.2 Volts min.
Number of line
4 = 4 lines
Type
B = Bidirectional
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
4
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 13. Flip Chip package mechanical data
700µm ± 50
315µm ± 50
650µm ± 65
210 µm
1.12 mm ± 50µm
5/8
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