ESDA14V2-4BF2 データシートの表示（PDF） - STMicroelectronics
部品番号
コンポーネント説明
メーカー
ESDA14V2-4BF2 Datasheet PDF : 7 Pages
| |||
ESDA14V2-4BF2
Figure 16: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location
4 +/- 0.1
Ø 1.5 +/- 0.1
0.73 +/- 0.05
All dimensions in mm
4 +/- 0.1
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings relat-
ed to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECO-
PACK specifications are available at: www.st.com.
Table 4: Ordering Information
Ordering code
ESDA14V2-4BF2
Marking
EA
Package
Flip-Chip
Weight
2.1 mg
Base qty
5000
Delivery mode
Tape & reel 7”
Note: More informations are available in the application notes:
AN1235: “Flip-Chip: Package description and recommendations for use”
Table 5: Revision History
Date
Revision
14-Mar-2005
1
18-Oct-2005
2
17-Jan-2006
3
Description of Changes
First issue.
Dimension from center bump to corner bump changed in
Figure 13 to indicate diagonal instead of perpendicular
measurement. No values changed. ECOPACK statement
added.
Die dimensions changed in Figure 13. Cavity depth
changed in Figure 16
6/7
Share Link: 