ESDALC6V1C2 データシートの表示（PDF） - STMicroelectronics
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ESDALC6V1C2 Datasheet PDF : 7 Pages
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ESDALC6V1C2
Figure 7. Flip-Chip footprint
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Ordering information
Figure 8. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
E
xxz
y ww
Figure 9.
Flip-Chip tape and reel specifications
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
ST E
xxz
yww
ST E
xxz
yww
ST E
xxz
yww
0.73 ± 0.05
4 ± 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
4
Ordering information
Part number
ESDALC6V1C2
Marking
ED
Package
Flip-Chip
Weight
2.1 mg
Base qty
5000
Delivery mode
Tape and reel
5/7
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