ESDALC6V1F2 データシートの表示（PDF） - STMicroelectronics
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ESDALC6V1F2 Datasheet PDF : 7 Pages
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ESDALC6V1F2
3
Package information
Figure 8. Flip-Chip dimensions
500 µm ± 10
250 µm ± 10
315 µm ± 50
Package information
650 µm ± 50
0.95 mm ± 50 µm
Figure 9. Flip-Chip footprint
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 10. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
E
xxz
y ww
5/7
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