ESDALC6V1M6 データシートの表示（PDF） - STMicroelectronics

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ESDALC6V1M6

4- and 5-line low capacitance Transil™ arrays for ESD protection

STMicroelectronics 

ESDALC6V1M6, ESDALC6V1-5M6

Recommendation on PCB assembly

4

Recommendation on PCB assembly

4.1

Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 15. Stencil opening dimensions

L

TW

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect

Ratio

=

W-----

T

≥

1.5

Aspect Area

=

------L-----×------W----------

2T(L + W)

≥

0.66

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 16. Recommended stencil window position

7 µm

7 µm

15 µm

236 µm

250 µm

15 µm

Footprint

Stencil window

Footprint

7/11

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