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FAN5009 データシートの表示(PDF) - Fairchild Semiconductor

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FAN5009
Fairchild
Fairchild Semiconductor Fairchild
FAN5009 Datasheet PDF : 13 Pages
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FAN5009
5. The paddle on the MLP package is internally referenced
to ground. It can be left floating or connected to ground.
For best thermal performance it should be connected to
ground as shown in Figure 7.
CBOOT
1
2
3
4
CVCC
8
7
6
5
PADDLE
VIAS
GROUND
Figure 7. Recommended layout for MLP package.
Also accepts SO8 package (not to scale)
6. The recommended land pattern shown in the MLP
mechanical dimensions will work with both MLP-8
and SO-8 packages.
The circuit in Figure 1 illustrates a typical implementation
of a single phase of a multi-phase buck converter for VCORE
applications. For a complete VR10 design example, please
refer to the FAN5019 or FAN5018 datasheets.
PRODUCT SPECIFICATION
10
REV. 1.0.5 7/22/04

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