FAN5701 データシートの表示（PDF） - Fairchild Semiconductor
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FAN5701 Datasheet PDF : 12 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum
ratings are stress ratings only.
Symbol
Parameter
VIN, VOUT Pins
VCC
Other Pins(1)
ESD
Human Body Model, JESD22-A114
Electrostatic Discharge
Protection Level
Charged Device Model, JESD22-C101
Charged Device Model, JESD22-C101
TJ
Junction Temperature
TSTG Storage Temperature
TL
Lead Soldering Temperature, 10 Seconds
Note:
1. Lesser of VIN + 0.3 or 6.0V.
UMLP16
WLCSP-16
Min.
–0.3
–0.3
–40
–65
Max.
6.0
AVIN + 0.3
3
2
1
+150
+150
+260
Units
V
V
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
VIN
VLED
TA
TJ
Supply Voltage
LED Forward Voltage
Ambient Temperature
Junction Temperature
Parameter
Min.
2.7
2
–40
–40
Max.
5.5
4
+85
+125
Units
V
V
°C
°C
Thermal Properties
Symbol
Parameter
Min. Typ. Max. Units
ΘJA
Junction-to-Ambient Thermal Resistance(2)
WLCSP
UMLP
80
°C/W
49
°C/W
Note:
2. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction
temperature TJ(max) at a given ambient temperate TA.
© 2009 Fairchild Semiconductor Corporation
FAN5701 • Rev. 1.0.3
5
www.fairchildsemi.com
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