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FSA1256(2008) データシートの表示(PDF) - Fairchild Semiconductor

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FSA1256 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Physical Dimensions
2X 0.10 C
B
1.6
A
INDEX AREA
1.6
2X 0.10 C
TOP VIEW
0.55 MAX
0.05 C
Recommended Landpattern
0.05
0.00
DETAIL A
8X(0.09)
1.0
12 3
C
0.5
4 (0.1)
8
4
0.05 C
(0.15)
8X
0.35
0.25
3X(0.2)
76
5
0.15
0.25
8X
BOTTOM VIEW
0.10 C A B
0.05 C
Notes:
1. PACKAGE CONFORMS TO JEDEC MO-255 VARIATION UAAD
2. DIMENSIONS ARE IN MILLIMETERS
3. DRAWING CONFORMS TO ASME Y.14M-1994
4. PIN 1 FLAG, END OF PACKAGE OFFSET
5. DRAWING FILE NAME: MKT-MAC08AREV4
MAC08AREV4
(0.20)
0.35
0.25
0.35
0.25
DETAIL A
PIN #1 TERMINAL
SCALE: 2X
Figure 17. 8-Lead MicroPak™, 1.6mm Wide
For tape and reel specifications for MicroPak, please visit:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2004 Fairchild Semiconductor Corporation
FSA1256(A) / FSA1257(A) / FSA1258(A) Rev. 1.0.5
9
www.fairchildsemi.com

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