HBTGFR421-S データシートの表示（PDF） - SEOUL SEMICONDUCTOR

部品番号

コンポーネント説明

メーカー

HBTGFR421-S

CHIP LED DEVICE

SEOUL SEMICONDUCTOR 

5. Soldering Profile

Reflow Soldering Conditions/ Profile

(1) Lead Solder

-Preliminary heating to be at 150℃max. for 2 minutes max.

-Soldering heat to be at 240℃max. for 5 seconds max.

°C

Operation heating

240

150

Pre-heating

Temperature

rise: 5°C/sec.

120

Cooling:

-5°C/sec.

0

60 to 120 sec.

5sec. max

(2) Lead-Free Solder

-Preliminary heating to be at 150℃max. for 2 minutes max.

-Soldering heat to be at 255℃max. for 20 seconds max.

°C

255

(+5)

Operation heating

150

Pre-heating

Temperature

rise: 5°C/sec.

120

Cooling:

-5°C/sec.

0

60 to 120 sec.

10 to 20 sec.

(3) Hand Soldering conditions

-Not more than 3 seconds @MAX280℃, under Soldering iron.

SSC-QP-0401-06(REV.0)

SEOUL SEMICONDUCTOR CO,. LTD.

148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea

TEL: 82-2-3281-6269 FAX: 82-2-858-5537

- 4/7-

HBTGFR421-S

Share Link: