HCPL-5201-300 データシートの表示（PDF） - HP => Agilent Technologies
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HCPL-5201-300
HP => Agilent Technologies
HCPL-5201-300 Datasheet PDF : 12 Pages
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3
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
1
VCC 8
1
VCC 8
2
VO
7
2
VO1
7
VO2
3
VE
6
3
6
4
5
4
5
GND
GND
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
2
VCC 15
3
VO1 14
4
VO2 13
5
VO3 12
6
VO4 11
7
GND 10
8
9
20 Pad LCCC
Surface Mount
2 Channels
15
VCC2
19
VO2
13
20
GND2 12
2
VO1VCC1 10
3
GND1
78
Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless
ceramic chip carrier) package has isolated channels with separate VCC and ground connections.
Outline Drawings
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
11.13 (0.438)
10.72 (0.422)
1.27 (0.050)
REF.
2.85 (0.112)
MAX.
8.13 (0.320)
MAX.
0.46 (0.018)
0.36 (0.014)
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.31 (0.012)
0.23 (0.009)
20 Terminal LCCC Surface Mount, 2 Channels
8 Pin DIP Through Hole, 1 and 2 Channel
1.78 (0.070)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
0.51 (0.020)
MIN.
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
3.81 (0.150)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
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