Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits
English
한국어
日本語
русский
简体中文
español
部品番号
コンポーネント説明
HCTS374D データシートの表示(PDF) - Intersil
部品番号
コンポーネント説明
メーカー
HCTS374D
Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
Intersil
HCTS374D Datasheet PDF : 11 Pages
1
2
3
4
5
6
7
8
9
10
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
D0
Q0
(3)
(2)
HCTS374MS
HCTS374MS
OE
VCC
Q7
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
(18) D7
(17) D6
(16) Q6
(15) Q5
D2 (7)
(14) D5
(8)
(9)
D3
Q3
(10)
(11)
GND
CP
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS374 is TA14404A.
Spec Number
518635
659
Share Link:
datasheetq.com [
Privacy Policy
]
[
Request Datasheet
] [
Contact Us
]