HDMP-0482 データシートの表示（PDF） - HP => Agilent Technologies
部品番号
コンポーネント説明
メーカー
HDMP-0482 Datasheet PDF : 12 Pages
| |||
Package Information
HDMP-0482 Thermal Characteristics, TC = 0°C to 85°C, VCC = 3.15V to 3.45V
Symbol Parameter
Unit
Typ.
Max.
θjc
Thermal Resistance, Junction to Case °C/W
9.5
—
Note: Based on independent testing by Agilent. θja for these devices is 39.4°C/W for the HDMP-0482.
θja is measured on a standard 3x3” FR4 PCB in a still air environment. To determine the actual
junction temperature in a given application, use the following equation: Tj = TC + (θjc x PD), where TC
is the case temperature measured on the top center of the package, and PD is the power being
dissipated.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity
(Seating Plane Method)
Details
Plastic
85% Tin, 15% Lead
300 – 800 micro-inches
0.20 mm max.
0.10 mm max.
PIN #1 ID
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
2
47
3
46
4
45
5
44
6
43
7
8
HDMP-0482
42
41
9
TOP VIEW
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
E1
E
b
D1
e
D
A2
c
G
L
Figure 10. HDMP-0482 Package Drawing.
A
A1
Mechanical Dimensions of HDMP-0482
Dimensional Parameter
(in millmeters)
D1/E1 D/E b
e
L
c
HDMP-0482
14.00 17.20 0.35 0.80 0.88 0.17
Tolerance
±0.10
±0.25 ±0.05 Basic +0.15/ Max
-0.10
G
A2
A1
A
0.25 2.00
0.25 2.35
Max
Gage +0.10/
Max
Plane -0.05
11
Share Link: 