HIP0082 データシートの表示（PDF） - Intersil
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HIP0082 Datasheet PDF : 12 Pages
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HIP0082, HIP0084
Power Small Outline Plastic Package (PSOP)
E2
2 PLACES
SEATING
PLANE
-C-
D1
N
E3
-B-
E1
E
D
3
2
-A-
1
b
e
-H-
A
3.10 REF.
A2
A1
0.10 C
SEE DETAIL "A"
SEATING
PLANE
0.15
REF.
A3
HEAT
SLUG
DETAIL "A"
B
B
L
1.60 REF.
L1 GAUGE
PLANE
0-8o
M20.433
20 LEAD POWER SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
0.122 0.142 3.10 3.60
-
A1 0.004 0.012 0.10 0.30
-
A2 0.118 0.130 3.00 3.30
-
A3 0.000 0.004 0.00 0.10
-
b
0.016 0.021 0.40 0.53
6, 7
b1
0.016 0.020 0.40 0.50
6, 7
c
0.009 0.013 0.23 0.32
7
c1
0.009 0.011 0.23 0.29
7
D
0.622 0.630 15.80 16.00
3
D1 0.496 0.512 12.60 13.00
-
D2
- 0.043
-
1.10
-
E
0.547 0.571 13.90 14.50
-
E1 0.429 0.437 10.90 11.10
4
E2
- 0.114
-
2.90
-
E3 0.228 0.244 5.80 6.20
-
e
0.050 BSC
1.27 BSC
-
L
0.031 0.043 0.80 1.10
5
L1
0.014 BSC
0.35 BSC
-
N
20
20
-
NOTES:
Rev. 0 3/96
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. "C" is a reference datum. Seating plane is defined by
lead tips only.
3. Dimension D does not include mold flash, protrusions
or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 per side. D measured at -H-.
4. Dimension E1 does not include interlead flash or pro-
trusion. Interlead flash or protrusion shall not exceed
0.15 per side. E1 measured at -H-.
5. Dimension "L" is the length of terminal for soldering to
a substrate.
6. The lead width dimension does not include dambar
protrusion. Allowable dambar protrusion shall be
0.08mm total in excess of the lead width dimension at
maximum material condition.
7. Section "B-B" to be determined at 0.10mm to 0.25mm
from the lead tip.
8. Controlling dimension: MILLIMETER.
9. Dimensions conform with JEDEC Outline MO-166AA
Issue B.
17.15
N
13.92
4.09
1.52
b1
c
c1
b
SECTION "B-B"
4.22 7.26
2.87
0.71
4.09
2.21
1
e
LAND PATTERN
9
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