HIP5062 データシートの表示（PDF） - Intersil

部品番号

コンポーネント説明

メーカー

HIP5062

Power Control IC Single Chip Dual Switching Power Supply

Intersil 

HIP5062

Pin Descriptions (Continued)

PAD NUMBER DESIGNATION

DESCRIPTION

32

CKIN

Clock input when XCKS is grounded.

33

XCKS

Grounding this terminal provides for the application of an external clock to CKIN input terminal.

For normal internal clock operation, this terminal may be left floating or returned to 12V. There

is an internal 30K pull-up resistor on this terminal.

34

DGND

Ground of the DMOS gate drivers. This pad is used for bypassing.

35

AGND

Analog ground.

36

VINP

Internal 5.1V reference. This point is usually bypassed.

37

IRFO2

A resistor placed between this pad and IRFI2 converts the VCMP2 signal to a current for the cur-

rent sense comparator. The maximum current set by the value of the resistor, according to the

equation: IPEAK = 16/R. Where R is the value of the external resistor in KΩ and must be greater

than 1.5KΩ but less than 10KΩ. For example, if the resistor chosen is 1.8K, the peak current will

be 8.8A. This assumes VCMP2 is 7.3V. Maximum output current should be kept below 10A.

38

IRFI2

See IRFO2.

39

TMON

This is the thermal shut down pad than can be used to disable the thermal shutdown circuit. By

returning this pad to VDDA or 12V the function is disabled. Returning this pad to ground will put

the IC into the thermal shutdown state. Thermal shutdown occurs at a nominal junction temper-

ature or +120oC. This terminal is normally returned to ground.

40

V+

This is the main supply voltage input pad to the regulator IC. Because of the high peak currents

this pad must be well bypassed with at least a 0.1µF capacitor.

6

Share Link: