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HIP6601B データシートの表示(PDF) - Intersil

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HIP6601B Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
HIP6601B, HIP6603B, HIP6604B
Ordering Information
PART NUMBER
PART
(Notes 1, 2) MARKING
TEMP.
RANGE
(°C)
PACKAGE PKG.
(Pb-free) DWG. #
HIP6601BCBZ* 6601 BCBZ 0 to +85 8 Ld SOIC M8.15
HIP6601BCBZA* 6601 BCBZ 0 to +85 8 Ld SOIC M8.15
HIP6601BECBZ* 6601 BECBZ 0 to +85 8 Ld EPSOIC M8.15B
HIP6601BECBZA* 6601 BECBZ 0 to +85 8 Ld EPSOIC M8.15B
HIP6603BCBZ* 6603 BCBZ 0 to +85 8 Ld SOIC M8.15
HIP6603BECBZ* 6603 BECBZ 0 to +85 8 Ld EPSOIC M8.15B
HIP6604BCRZ* 66 04BCRZ 0 to +85 16 Ld QFN L16.4x4
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free
material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and
compatible with both SnPb and Pb-free soldering operations). Intersil Pb-
free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. For Moisture Sensitivity Level (MSL), please see device information
page for HIP6601B, HIP6603B, HIP6604B. For more information
on MSL, please see Technical Brief TB363.
Pinouts
HIP6601BCB, HIP6603BCB,
HIP6601BECB, HIP6603BECB,
(8 LD SOIC, EPSOIC)
TOP VIEW
UGATE 1
BOOT 2
PWM 3
GND 4
8 PHASE
7 PVCC
6 VCC
5 LGATE
HIP6604B
(16 LD QFN)
TOP VIEW
16 15 14 13
NC 1
BOOT 2
PWM 3
GND 4
12 NC
11 PVCC
10 LVCC
9 VCC
5678
Block Diagrams
PVCC
VCC
+5V
PWM
10k
CONTROL
LOGIC
10k
HIP6601B AND HIP6603B
SHOOT-
THROUGH
PROTECTION
BOOT
UGATE
PHASE
LGATE
VCC FOR HIP6601B
PVCC FOR HIP6603B
PAD
GND
FOR HIP6601BECB AND HIP6603BECB DEVICES, THE PAD ON THE BOTTOM
SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD.
PVCC
VCC
+5V
PWM
GND
10k
CONTROL
LOGIC
10k
HIP6604B QFN PACKAGE
BOOT
UGATE
SHOOT-
THROUGH
PROTECTION
PHASE
CONNECT LVCC TO VCC FOR HIP6601B CONFIGURATION
LVCC CONNECT LVCC TO PVCC FOR HIP6603B CONFIGURATION.
LGATE
PAD
PGND
PAD ON THE BOTTOM SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD
2
FN9072.8
May 1, 2012

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