HIP9011AB データシートの表示（PDF） - Intersil
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HIP9011AB Datasheet PDF : 11 Pages
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HIP9011
Absolute Maximum Ratings
DC Logic Supply, VDD . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Output Voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Input Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Max
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
120
Maximum Power Dissipation, PD
For
For
TA
TA
=
=
-40oC to 70oC .
70oC to 125oC,
......
Derate
Maximum Junction Temperature . .
.........
Linearly at
.........
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
400mW Max
. . . 6mW/oC
. . . . .150oC
Maximum Storage Temperature Range, TSTG . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
At a Distance 1/16 ±1/32 inch, (1.59 ±0.79mm) from Case for
10s Max. (SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VDD = 5V ±5%, GND = 0V, Clock Frequency 4MHz ±0.1%, TA = -40oC to 125oC,
Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP
DC ELECTRICAL SPECIFICATIONS
Quiescent Supply Current
IDD
VDD = 5.25V, GND = 0V
-
Midpoint Voltage, Pin 3
VMID
VDD = 5.0V, IL = 2mA Source
2.3
Midpoint Voltage, Pin 3
VMID
VDD = 5.0V, IL = 0mA
2.4
Low Input Voltage, Pins INT/HOLD, CS, SI, SCK
VIL
-
High Input Voltage, Pins INT/HOLD, CS, SI, SCK
VIH
70
Hysteresis voltage, Pins INT/HOLD, CS, SI, SCK
VHYST
0.85
Internal Pull-Up Current
I Source CS, SI, VDD = 5.0V, Measured at GND
-
SCK, TEST
5.0
2.45
2.5
-
-
-
50
Internal Pull-Down Current
I Sink,
VDD = 5.0V, Measured at VDD
-
-50
INT/ HOLD
Low Level Output, Pin SO
High Level Output, Pin SO
Three-State Leakage Pin SO
Low Level Output, Pin 10, OSCOUT
High Level Output, Pin 10, OSCOUT
VOL
VOH
IL
VOL
VOH
ISOURCE = 1.6mA, VDD = 5.0V 0.01
-
ISINK = 200µA, VDD = 5.0V
4.8
4.9
Measured at GND; VDD = 5.0V
-
-
ISOURCE = 500µA; VDD = 5.0V
-
-
ISINK = -500µA; VDD = 5.0V
4.4
-
SPI BUS INTERFACE AC Parametrics
CS Falling to SCLK Rising
CS Rising to SCLK Falling
SCLK Low
SCLK High
SCLK Falling to CS Rising
Data High Setup Time
Data Low Setup Time
Data High Hold Time
Data Low Hold Time
Min Time Between 2 Programmed Words
CS Rising to INT/Hold Rising
tCCH
tCCL
tPWL
tPWH
tSCCH
tSUH
tSUL
tHH
tHL
tCSH
tCIH
10
-
80
-
60
-
60
-
60
-
20
-
20
-
10
-
10
-
200
-
8
-
MAX
UNITS
8.0
mA
2.55
V
2.6
V
30
% of VDD
-
% of VDD
-
V
-
µA
-
µA
0.30
V
5.0
V
±10
µA
1.5
V
-
V
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
µs
3
FN4367.2
January 6, 2006
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