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HLMP-BG01-L0KDD データシートの表示(PDF) - HP => Agilent Technologies

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HLMP-BG01-L0KDD Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package Dimensions
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
A
0.70 (0.028)
MAX.
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
31.60
(1.244)
MIN.
1.00 MIN.
(0.039)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.50 ±0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
2.54 ± 0.38
(0.100 ± 0.015)
B
11.70
+ 0.13
– 0.08
( ) 0.461
+ 0.005
– 0.003
CATHODE
LEAD
31.60
(1.244)
MIN.
1.00 MIN.
(0.039)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
C
0.70 (0.028)
MAX.
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
31.60
(1.244)
MIN.
1.00 MIN.
(0.039)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
D
1.50 ±0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
31.60
(1.244)
MIN.
1.00 MIN.
(0.039)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 IN.) DOWN THE LEADS.
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
– LAMP PACKAGES A AND C WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE
OF LAMP PACKAGE = 1.143/1.067 mm (0.044/0.042 IN.).
– LAMP PACKAGES B AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS.
5

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