HLMP-UG06 データシートの表示（PDF） - HP => Agilent Technologies
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HLMP-UG06 Datasheet PDF : 8 Pages
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Package Dimensions
A
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
31.60
(1.244)
MIN.
CATHODE
LEAD
0.70 (0.028)
MAX.
2.35 (0.093)
MAX.
1.00 MIN.
(0.039)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
CATHODE
FLAT
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
B
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
(311.2.6404)MIN.
CATHODE
LEAD
0.70 (0.028)
MAX.
1.00 MIN.
(0.039)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
C
d
31.60
(1.244)
MIN.
CATHODE
LEAD
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
1.00 MIN.
(0.039)
CATHODE
FLAT
D
d
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
31.60
(1.244)
MIN.
CATHODE
LEAD
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
1.00 MIN.
(0.039)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
• LAMP PACKAGES A AND B WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
• LAMP PACKAGES C AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS
= 0.965/0.889 (0.038/0.035).
5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGES
C AND D, SEE TABLE.
2.54 ± 0.38
(0.100 ± 0.015)
PART NO.
d
HLMP-XX10
-XX07
HLMP-XX17
-XX14
12.37 ± 0.25
(0.487 ± 0.010)
12.42 ± 0.25
(0.489 ± 0.010)
HLMP-XX26 12.52 ± 0.25
-XX23 (0.493 ± 0.010)
HLMA-XX32 11.96 ± 0.25
-XX29 (0.471 ± 0.010)
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