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HMC-ALH382(V01) データシートの表示(PDF) - Hittite Microwave

部品番号
コンポーネント説明
メーカー
HMC-ALH382
(Rev.:V01)
Hittite
Hittite Microwave Hittite
HMC-ALH382 Datasheet PDF : 6 Pages
1 2 3 4 5 6
v01.0108
Absolute Maximum Ratings
Drain Bias Voltage
Gate Bias Voltage
RF Input Power
Storage Temperature
Operating Temperature
+5.5 Vdc
-1 to +0.3 Vdc
-5 dBm
-65 to +150 °C
-55 to +85 °C
HMC-ALH382
GaAs HEMT LOW NOISE
AMPLIFIER, 57 - 65 GHz
1
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
WP - 8
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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