HMC240(V02) データシートの表示（PDF） - Hittite Microwave
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HMC240 Datasheet PDF : 6 Pages
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HMC240
v02.0910
UED Outline Drawing
GaAs MMIC SPDT SWITCH
DC - 4 GHz
DISCPORONTDIUNCT Not Recommended for New Designs
7
Die Packaging Information [1]
Standard
Alternate
GP-5 (Gel-Pak®)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. DIMENSIONS IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS 0.005”.
3. TYPICAL BOND PAD IS 0.004” SQUARE.
4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.
5. BOND PAD METALLIZATION: GOLD.
6. PADS 4 AND 6 MUST BE CONNECTED TO RF/DC GROUND.
Pad Descriptions
Pad Number
Function
Description
See truth table and control voltage table.
1, 7
A, A (alt.)
Connect either pad 1 or pad 7 to control logic input.
2, 5, 8
RF1, RFC, RF2
These pads are DC coupled and matched to 50 Ohms.
Blocking capacitors are required.
See truth table and control voltage table.
3, 9
B, B (alt.)
Connect either pad 3 or pad 9 to control logic input.
Interface Schematic
4, 6
AC GND
Must be connected to RF/DC ground.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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