HMC240 データシートの表示（PDF） - Hittite Microwave

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HMC240

GaAs MMIC SPDT SWITCH DC - 4.0 GHz

Hittite Microwave 

v00.0403

MICROWAVE CORPORATION

Outline Drawing

HMC240

GaAs MMIC SPDT SWITCH

DC - 4.0 GHz

NOTES:

1. DIMENSIONS IN INCHES [MILLIMETERS].

2. DIE THICKNESS IS 0.005”.

3. TYPICAL BOND PAD IS 0.004” SQUARE.

4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.

5. BOND PAD METALLIZATION: GOLD.

6. PADS 4 AND 6 MUST BE CONNECTED TO RF/DC GROUND.

7

Pad Descriptions

Pad Number

Function

Description

1, 7

A, A (alt.)

See truth table and control voltage table.

Connect either pad 1 or pad 7 to control logic input.

2, 5, 8

RF1, RFC, RF2

These pads are DC coupled and matched to 50 Ohms.

Blocking capacitors are required.

3, 9

B, B (alt.)

See truth table and control voltage table.

Connect either pad 3 or pad 9 to control logic input.

4, 6

AC GND

Must be connected to RF/DC ground.

Interface Schematic

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

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