DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

HMC323 データシートの表示(PDF) - Hittite Microwave

部品番号
コンポーネント説明
メーカー
HMC323 Datasheet PDF : 6 Pages
1 2 3 4 5 6
v01.0701
MICROWAVE CORPORATION
HMC323
GaAs InGaP HBT MMIC DRIVER
AMPLIFIER, DC - 3.0 GHz
Evaluation PCB for HMC323
1
The circuit board used in the nal application should use RF circuit design techniques. Signal lines should have 50 ohm
impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A
sufcient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board
shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Item
Description
J1 - J2
PC Mount SMA Connector
U1
HMC323
PCB*
104196 Evaluation PCB 1.5" x 1.5"
* Circuit Board Material: Rogers 4350
1 - 156
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]