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HMC897 データシートの表示(PDF) - Hittite Microwave

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HMC897 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
v00.0112
Outline Drawing
HMC897
FILTER - TUNABLE, BAND PASS
9 - 19 GHz
Die Packaging Information [1]
Standard
Alternate
WP-9
[2]
[1] Refer to “Waffle-Pak & Gel-Pak” section for die packaging dimensions.
[2] For alternate packaging information contact Hittite Microwave Corpora-
tion.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE..
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METALIZATION: GOLD
7. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR UNLABELED PADS.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
6
Application Support: Phone: 978-250-3343 or apps@hittite.com

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