HSDL-3200 データシートの表示（PDF） - HP => Agilent Technologies

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HSDL-3200

IrDA® Data 1.4 Compliant 115.2 Kb/s Infrared Transceiver

HP => Agilent Technologies 

Recommended Metal Solder Stencil

Aperture

It is recommended that only

0.127 mm (0.005 inches) or 0.11

mm (0.004 inches) thick stencil

be used for solder paste

printing. This is to ensure

adequate printed solder paste

volume and no shorting. The

following combination of metal

stencil aperture and metal

stencil thickness should be used:

APERTURES AS PER

LAND DIMENSIONS

l

w, the width of aperture is fixed

at 0.55 mm (0.022 inches).

Aperture opening for shield pad

is as per land pattern.

t, nominal stencil thickness

mm

inches

0.127

0.005

0.11

0.004

Adjacent Land Keepout and Solder

Mask Areas

Adjacent land keep-out is the

maximum space occupied by the

k

unit relative to the land pattern.

There should be no other SMD

components within this area.

h

“h” is the minimum solder resist

strip width required to avoid

solder bridging adjacent pads.

Y

X

It is recommended that two

fiducial crosses be placed at

mid-length of the pads for unit

alignment.

Note: Wet/Liquid Photo-

Imageable solder resist/mask is

recommended.

DIMENSION

h

k

j

m

mm

MIN. 0.2

8.2

2.6

3.0

INCHES

MIN. 0.008

0.323

0.102

0.118

t

w

l, length of aperture

mm

inches

1.75 ± 0.05

0.102 ± 0.002

2.4 ± 0.05

0.118 ± 0.002

Recommended Solder Paste/Cream

Volume for Castellation Joints

Based on calculation and

j experiment, the printed solder

paste volume required per

castellation pad is 0.22 cubic

mm (based on either no-clean or

m aqueous solder cream types with

typically 60% to 65% solid

content by volume). Using the

recommended stencil will result

in this volume of solder paste.

10

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