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HSDL-3209 データシートの表示(PDF) - HP => Agilent Technologies

部品番号
コンポーネント説明
メーカー
HSDL-3209
HP
HP => Agilent Technologies HP
HSDL-3209 Datasheet PDF : 16 Pages
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Moisture Proof Packaging
All HSDL-3209 options are
shipped in moisture proof
package. Once opened,
moisture absorption begins.
This part is compliant to
JEDEC Level 4.
Units in A Sealed
Mositure-Proof
Package
Package Is
Opened (Unsealed)
No Baking
Is Necessary
Environment
less than 30 deg C, and
less than 60% RH ?
Yes
Yes
Package Is
Opened less
than 72 hours ?
No
No
Perform Recommended
Baking Conditions
Baking Conditions:
If the parts are not stored in
dry conditions, they must be
baked before reflow to prevent
damage to the parts.
Baking should only be done
once.
Package Temperature Time
In Reel
60°C 48 hours
In Bulk
100°C 4 hours
125°C 2 hours
150°C 1 hours
Recommended Storage Conditions:
Time from unsealing to soldering:
After removal from the bag,
the parts should be soldered
within 72 hours if stored at
the recommended storage
conditions. If times longer than
72 hours are needed, the parts
must be stored in a dry box.
Storage
Temperature
Relative Humidity
10°C to 30°C
below 60% RH
8

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