HSP061-2(2012) データシートの表示（PDF） - STMicroelectronics
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HSP061-2 Datasheet PDF : 12 Pages
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Recommendation on PCB assembly
4
Recommendation on PCB assembly
HSP061-2
4.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 17. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect
Ratio
=
W-----
T
≥ 1.5
Aspect Area
=
-------L-----×----W-----------
2T(L + W)
≥
0.66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 18. Recommended stencil window position for µQFN-6L
7 µm
7 µm
15 µm
236 µm
250 µm
15 µm
Footprint
Stencil window
Footprint
8/12
Doc ID 022777 Rev 1
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